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Flexible PCB(耐熱) - List of Manufacturers, Suppliers, Companies and Products | IPROS GMS

Last Updated： Aggregation Period:Jul 29, 2026～Aug 25, 2026
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Flexible PCB Product List

1～27 item / All 27 items

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All LCP Flexible Printed Circuit Board (FPC)

All LCP Flexible Printed Circuit Board (FPC)

Next-generation flexible substrate with high heat resistance, low loss, and chemical resistance, all made of LCP!

All LCP is a high-performance flexible printed circuit board (FPC) made entirely of liquid crystal polymer (LCP) without the use of adhesives. Compared to conventional polyimide FPCs, it features high heat resistance, low moisture absorption, low loss characteristics, chemical resistance, and low outgassing properties, providing stable performance even in harsh environments. It is particularly suitable for applications that require reduced transmission loss of high-frequency signals and improved durability in environments where oils and chemicals are used.

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  • Printed Circuit Board
  • Flexible PCB

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Flexible Printed Circuit (FPC) "Transparent FPC"

Flexible Printed Circuit (FPC) "Transparent FPC"

Introducing a flexible printed circuit board (FPC) that balances transparency and solderability!

"Transparent FPC" is a flexible printed circuit board (FPC) that excels in transparency and heat resistance, using transparent polyimide film as its substrate. We have worked on developing an FPC that achieves both high heat resistance and transparency by adopting a highly heat-resistant transparent polyimide film, thereby solving the issues of warping and dimensional changes caused by heat during reflow. As a result, it can be applied to various fields such as wearable devices and medical equipment, which prioritize design. [Features] - Uses highly heat-resistant transparent polyimide film - Can utilize the existing design rules of conventional FPCs - Proposes new wiring styles in fields such as medical, lighting, and industrial equipment *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Flexible PCB

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Achieved without adhesive! Long-term high-temperature durable flexible substrate.

Achieved without adhesive! Long-term high-temperature durable flexible substrate.

Passed long-term heat resistance test at 200℃ for 1000 hours! High-temperature durable flexible substrate with insulation characteristics exceeding JIS standards.

The "Long-term High-Temperature Durable Flexible Circuit Board" is an FPC that achieves long-term heat resistance without the use of epoxy-based adhesives, making it suitable for harsh conditions in high-temperature environments. Even after undergoing our unique long-term high-temperature test conditions of 200°C for 1000 hours, the insulation resistance, continuity resistance change rate, and dielectric strength meet the JIS passing standards. 【Main Features】 1. Achieves high-temperature durability with a structure that does not use epoxy-based adhesives. 2. Heat resistance suitable for long-term use in high-temperature environments. 3. Insulation properties are maintained even after the long-term high-temperature test of 200°C for 1000 hours. For more details, please refer to the PDF document or feel free to contact us.

  • Wiring materials
  • Flexible PCB

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Yamashita Material Flexible Substrate Product Lineup

Yamashita Material Flexible Substrate Product Lineup

We have a wide variety of products available, including "high-temperature resistant and oil-resistant FPC" and "high-speed transmission connector compatible FPC"! A new catalog featuring high-current FPC (with signal lines) has also been added.

We would like to introduce the flexible substrates handled by Yamashita Material Co., Ltd. We offer a wide range of products, including the "YFC Normal Type," which can be created in specified lengths, core counts, and pitches, as well as the "High-Temperature Durable and Oil-Resistant FPC," which uses liquid crystal polymer (LCP) for the base and cover materials and has long-term heat resistance of 240°C. Detailed product features, examples of product configurations, and standard specifications are available in our catalog, so please download it for more information. 【Product Lineup (Partial)】 ■ YFC Normal Type ■ YFC Shielded Type ■ YFC Ear Type / Notched Type ■ YFC LVDS Type ■ High-Temperature Durable and Oil-Resistant FPC ■ Long-Term High-Temperature Durable FPC ■ High-Speed Transmission Connector Compatible FPC ■ High-Speed Transmission Multi-Layer FPC ■ High-Density High-Multi-Layer FPC ■ High-Heat-Resistant Heat Dissipation FPC ■ Multi-Layer Coil FPC ■ High-Current FPC with Signal Lines *For more details, please refer to the PDF document or feel free to contact us.

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  • Board to FPC connector
  • Flexible PCB

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Transparent flexible printed circuit board (transparent FPC)

Transparent flexible printed circuit board (transparent FPC)

A transparent flexible substrate with wiring that cannot be seen with the naked eye.

It is a flexible substrate with invisible wiring that has a total light transmittance of 92.0% and allows for component mounting.

  • Printed Circuit Board
  • Touch Panel
  • Sensors
  • Flexible PCB

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Transparent Polyimide Flexible Substrate (FPC/Flexible Substrate)

Transparent Polyimide Flexible Substrate (FPC/Flexible Substrate)

It is a flexible substrate that combines heat resistance and transparency. FPC

Compared to glass materials, it is possible to create unique design concepts not only for flat surfaces but also for curved surfaces, folding, and wrapping, thereby expanding the design possibilities for mounted devices. It is expected to be used as a substitute for glass substrates in applications such as: - Transparent conductive substrates for touch panels - Organic EL and LED lighting substrates - Displays for mobile phones. Additionally, bare chip LEDs will be implemented on transparent polyimide substrates using wire bonding, followed by resin encapsulation. Light will pass through the transparent polyimide and beautifully illuminate the opposite side.

  • Circuit board design and manufacturing
  • Contract manufacturing
  • Contract Analysis
  • Flexible PCB

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Stretchable flexible printed circuit board (FPC/flexible board)

Stretchable flexible printed circuit board (FPC/flexible board)

It is a flexible circuit board that can be repeatedly stretched and contracted, and can follow deformation. FPC

While general flexible materials can be bent, they face challenges in folding and stretching. Due to their flexibility, stretchability, and ability to conform, they are expected to be used in a wide range of fields for flexible electronics devices, including wearables, sensors, displays, robotics, as well as pressure sensors and seat heaters. FPC.

  • Circuit board design and manufacturing
  • Contract manufacturing
  • Contract Analysis
  • Flexible PCB

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High-frequency compatible flexible substrate (MPI specification)

High-frequency compatible flexible substrate (MPI specification)

Supports low transmission loss and impedance matching! There are various applications such as mobile electronic devices and IoT devices.

The "High-Frequency Compatible FPC (MPI Specification)" is a product designed to support low transmission loss and impedance matching. 〇 It has excellent heat resistance and can accommodate solder mounting and bonding. 〇 It allows for high flexibility in processing, similar to standard polyimide. ● FPC high-frequency analysis service (optional) It can be used for various applications. 【Examples of Applications】 ■ Mobile electronic devices such as smartphones ■ Optical communication modules ■ IoT devices ■ Video equipment (4K/8K) ■ Other alternatives to coaxial cables #Flex #FPC #FlexibleCircuitBoard #FlexiblePrintedCircuitBoard #CircuitBoard #PrintedCircuitBoard #HighFrequency #Impedance #ShortLeadTime #MassProduction

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  • Other electronic parts
  • Flexible PCB

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Flexible circuit board

Flexible circuit board

Impedance accuracy is within standard ±10% and high precision ±5%! Available for small quantities.

"Flexible printed circuit boards" are printed circuit boards formed on an insulating film that is flexible and can be significantly deformed, such as being bent. Impedance control is also available, and we can provide small quantities. They are used in a wide variety of electronic and precision devices, including mobile devices, wearable devices, and medical equipment. 【Specifications】 ■ Number of layers: Single-sided / Double-sided ■ Board thickness: Base thickness 25μm / 50μm ■ Surface treatment: Heat-resistant preflux, electrolytic and electroless gold plating ■ Impedance accuracy: Standard ±10% or less, high precision ±5% or less *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Flexible PCB

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Flexible Printed Circuit (FPC) Comprehensive Catalog

Flexible Printed Circuit (FPC) Comprehensive Catalog

A large number of flexible circuit boards that are thin and lightweight, making them excellent for space-saving solutions!

This catalog features a wide range of "Flexible Printed Circuits (FPC)" that our company handles. We offer products such as "High-Flex FPC," which demonstrates excellent bending performance even in narrow spaces, "Self-Supporting Sliding FPC," which can slide and bend while remaining upright in the air, and "Power FPC," which can handle high currents. 【Contents】 ■ FPC Product Concepts ■ Areas of Achievement ■ Process Overview ■ What is a Flexible Printed Circuit (FPC)? ■ Product Introduction *For more details, please refer to the PDF document or feel free to contact us.

  • cable
  • Flexible PCB

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Low-loss flexible substrate

Low-loss flexible substrate

Combining PTFE base and low dielectric coverlay to produce various low-loss FPCs!

Our company manufactures low-loss flexible substrates (GHz band, Microstrip Line). We would like to introduce a flexible substrate that significantly improves transmission loss compared to the combination of polyimide-based and standard coverlay products. Using a PTFE base with a low-dielectric coverlay, we can expect a 60-70% improvement in transmission loss at the 40GHz band compared to standard products. Additionally, while the performance is slightly lower compared to PTFE-based substrates, a combination of LCP base and LCP coverlay can also expect about a 50% improvement in transmission loss and is suitable for long-term heat resistance and low outgassing applications due to the absence of adhesives. *For more details, please refer to the PDF materials or feel free to contact us. *Abbreviation explanations: PTFE ... Fluoropolymer LCP ... Liquid Crystal Polymer

  • Wiring materials
  • Flexible PCB

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Ultra-thin high-bend type flexible printed circuit board (FPC/flexible board)

Ultra-thin high-bend type flexible printed circuit board (FPC/flexible board)

We propose an extremely thin and highly flexible FPC.

It excels in various characteristics such as thinness, lightness, flexibility, resistance to bending, and resistance to breaking. Due to its excellent properties, it is used in movable parts such as sliding and twisting.

  • Circuit board design and manufacturing
  • Contract manufacturing
  • Contract Analysis
  • Flexible PCB

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Flying lead flexible printed circuit board (FPC/flexible circuit board)

Flying lead flexible printed circuit board (FPC/flexible circuit board)

It is a flexible substrate that allows for a highly reliable connection.

By partially removing the base film, it is possible to form a conductor. By narrowing the pattern width, reliable connections to the opposing circuit or device can be achieved, similar to wire bonding. It is used in areas that require high density and high reliability, such as probes.

  • Circuit board design and manufacturing
  • Contract manufacturing
  • Contract Analysis
  • Flexible PCB

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Blind Via (BVH) connection Flexible Printed Circuit (FPC)

Blind Via (BVH) connection Flexible Printed Circuit (FPC)

It is a flexible substrate effective for high-density wiring. FPC

Unlike conventional through holes, to avoid penetrating the hole, a via is placed directly under the pad. Fine hole processing using lasers is possible, making it effective for ultra-high-density wiring, etc. With the miniaturization and thinning of mobile devices, as well as the enhancement of communication devices, there is an increasing demand for high-density mounting of narrow pitch, multi-pin packages. Consequently, flexible substrates are also advancing in terms of high-layer count and high density. FPC

  • Circuit board design and manufacturing
  • Contract manufacturing
  • Contract Analysis
  • Flexible PCB

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High heat-resistant, low-loss flexible substrate for IoT devices

High heat-resistant, low-loss flexible substrate for IoT devices

Flexible substrate that contributes to power saving of IoT devices with high heat resistance and low loss.

In the IoT device industry, there is a demand for miniaturization while simultaneously extending battery life. Particularly in devices that operate in high-temperature environments or use high-frequency signals, the performance of the substrate significantly impacts the overall power efficiency of the device. Conventional substrates have sometimes hindered power saving due to issues with high-frequency signal loss and heat resistance. Our high-heat-resistant, low-loss flexible substrate contributes to the power efficiency of IoT devices with its low-loss characteristics and high heat resistance. 【Usage Scenarios】 - Wearable devices - Smart sensors - Industrial IoT equipment 【Benefits of Implementation】 - Extended battery life - Miniaturization of devices - Stable transmission of high-frequency signals

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  • Printed Circuit Board
  • Flexible PCB

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High Heat Resistance and Low Loss Flexible Substrate for 5G Communication

High Heat Resistance and Low Loss Flexible Substrate for 5G Communication

Flexible substrates with high heat resistance and low loss that support high-speed 5G communication.

In the 5G communication industry, substrates with excellent high-frequency characteristics are required to ensure stable high-speed data transmission. It is particularly important to minimize signal loss and maintain performance even in high-temperature environments. Conventional substrates may lead to issues with high-frequency signal loss and heat resistance, potentially resulting in decreased communication speeds and equipment failures. Our high-heat-resistant, low-loss flexible substrates achieve both low-loss characteristics and high heat resistance, contributing to the acceleration of 5G communication. 【Usage Scenarios】 - Base stations - High-speed data communication devices - High-frequency circuits 【Benefits of Implementation】 - Reduction of high-frequency signal loss - Stable operation in high-temperature environments - Improvement in communication speed

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  • Printed Circuit Board
  • Flexible PCB

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High heat-resistant, low-loss flexible substrate for home appliances

High heat-resistant, low-loss flexible substrate for home appliances

A flexible substrate that achieves slim, high-performance home appliances with high heat resistance and low loss.

In the home appliance industry, there is a simultaneous demand for thinner and higher-performance products. To maintain high performance within limited space, it is important to miniaturize the circuit board and reduce the loss of high-frequency signals. Our high heat-resistant, low-loss flexible circuit boards contribute to the improvement of home appliance performance by achieving thinness while providing high heat resistance and low loss characteristics. 【Application Scenarios】 - Thin televisions - Smartphones - Wearable devices 【Benefits of Implementation】 - Miniaturization of products - Reduction of high-frequency signal loss - Improvement of product reliability

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  • Printed Circuit Board
  • Flexible PCB

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High heat-resistant, low-loss flexible substrate for displays

High heat-resistant, low-loss flexible substrate for displays

Flexible substrate with high heat resistance and low loss that contributes to high-quality displays.

In the display industry, there is a demand for high image quality, along with thinner products and high-density mounting. Particularly in displays that operate in high-temperature environments or use high-frequency signals, the heat resistance and low loss characteristics of the substrate are essential for maintaining product performance. Inappropriate substrates can lead to display malfunctions or performance degradation. Our high heat-resistant, low loss flexible substrates meet the demands of high-quality displays. 【Usage Scenarios】 - High-definition displays - Displays compatible with high-frequency signals - Displays used in high-temperature environments 【Benefits of Implementation】 - Achievement of high-quality display - Improvement in product reliability - Contribution to thinner designs and high-density mounting

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  • Printed Circuit Board
  • Flexible PCB

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High heat-resistant, low-loss all-LCP flexible substrate for semiconductor manufacturing.

High heat-resistant, low-loss all-LCP flexible substrate for semiconductor manufacturing.

High-precision semiconductor manufacturing supported by high heat resistance and low loss flexible substrates.

In the semiconductor manufacturing industry, high-precision process control and stable performance are required. Particularly in situations involving high-temperature environments and high-frequency signals, the heat resistance and low-loss characteristics of substrates are crucial. Conventional substrates may suffer from deformation due to heat and signal attenuation, which can compromise manufacturing precision and product reliability. Our all-LCP flexible substrates offer high heat resistance, low-loss characteristics, and low outgassing, supporting high-precision processes in semiconductor manufacturing. 【Application Scenarios】 - Semiconductor manufacturing equipment - High-frequency circuits - Cleanroom environments 【Benefits of Implementation】 - Stabilization of manufacturing processes - Improvement in product reliability - Enhancement of yield

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  • Printed Circuit Board
  • Flexible PCB

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High Heat Resistance and Low Loss All-LCP Flexible Substrate for 5G Communication

High Heat Resistance and Low Loss All-LCP Flexible Substrate for 5G Communication

Flexible substrates with high heat resistance and low loss that support high-speed communication.

In the 5G communication industry, components with excellent high-frequency characteristics are required to achieve high-speed data transmission. It is particularly important to minimize signal transmission loss and ensure stable communication quality. Conventional substrates may face challenges with losses in the high-frequency range. Our high-heat-resistant, low-loss all-LCP flexible substrates utilize low dielectric constant materials to reduce losses of high-frequency signals, contributing to the acceleration of 5G communication. 【Application Scenarios】 - Base stations - High-speed data communication devices - High-frequency circuits 【Benefits of Implementation】 - Stabilization of high-speed data communication - Reduction of signal loss - Improvement of communication quality

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  • Printed Circuit Board
  • Flexible PCB

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Aerospace-grade high heat-resistant, low-loss flexible substrate

Aerospace-grade high heat-resistant, low-loss flexible substrate

Flexible substrates for aerospace applications that achieve both lightweight and high performance.

In the aerospace industry, reducing the weight of aircraft is essential for improving fuel efficiency and performance. At the same time, high safety and reliability are required, making electronic components that can perform stably even in harsh environments crucial. Our high heat-resistant, low-loss flexible circuit boards are lightweight yet equipped with high heat resistance, low loss characteristics, and chemical resistance, meeting the stringent demands of aerospace applications. 【Application Scenarios】 * Aircraft * Space probes * Satellites * Electronic devices requiring weight reduction 【Benefits of Implementation】 * Improved fuel efficiency through weight reduction * Stable operation in harsh environments * High reliability * Increased design flexibility

  • スクリーンショット 2025-02-19 085503.jpg
  • Printed Circuit Board
  • Flexible PCB

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[For Defense] High Heat Resistance and Low Loss All LCP Flexible Circuit Board

[For Defense] High Heat Resistance and Low Loss All LCP Flexible Circuit Board

A highly durable flexible substrate that demonstrates stable performance even in harsh environments.

In the defense sector, the reliability of equipment and long-term operation are required. Particularly for electronic devices used in harsh environments such as temperature changes, vibrations, and shocks, the durability of the substrate is crucial. Conventional substrates may experience performance degradation in high-temperature environments and damage to joints due to vibrations. Our high-heat-resistant, low-loss all-LCP flexible substrates offer high heat resistance, low moisture absorption, and chemical resistance, providing stable performance even in harsh conditions. 【Application Scenarios】 - Military communication equipment - Aerospace equipment - Missile systems - Radar systems 【Benefits of Implementation】 - High reliability in harsh environments - Long product lifespan - Reduction in maintenance costs

  • スクリーンショット 2025-02-19 085503.jpg
  • Printed Circuit Board
  • Flexible PCB

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High heat-resistant, low-loss LCP flexible substrate for data centers

High heat-resistant, low-loss LCP flexible substrate for data centers

Solving heat management and signal loss in high-density data centers.

In the data center industry, the high-density implementation of servers is advancing, and the increase in heat generation and losses due to faster signals are becoming challenges. High density is essential for processing more information in limited space, but it simultaneously causes issues such as performance degradation due to heat and signal attenuation. Our high-heat-resistant, low-loss all-LCP flexible circuit boards address these challenges. 【Usage Scenarios】 - High-density implementation servers - High-speed communication devices - High-frequency compatible circuit boards 【Benefits of Implementation】 - Improved long-term reliability due to high heat resistance - Maintenance of signal quality due to low-loss characteristics - Contribution to space-saving solutions

  • スクリーンショット 2025-02-19 085503.jpg
  • Printed Circuit Board
  • Flexible PCB

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High heat-resistant, low-loss flexible substrate for wearables

High heat-resistant, low-loss flexible substrate for wearables

A flexible substrate that achieves both miniaturization and high performance without the use of adhesives.

As wearable devices continue to shrink in size, the enhancement of circuit board performance is essential. In particular, high-density implementation in limited space and high reliability are required. It is also important to accommodate high-temperature environments and high-frequency signals. Our high heat-resistant, low-loss all-LCP flexible circuit boards meet these challenges. 【Usage Scenarios】 - Smartwatches - VR/AR devices - Healthcare devices - Wearable sensors 【Benefits of Implementation】 - Compatibility of miniaturization and high performance - High reliability - Improvement of high-frequency characteristics

  • スクリーンショット 2025-02-19 085503.jpg
  • Printed Circuit Board
  • Flexible PCB

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High heat-resistant, low-loss flexible substrate for robotics

High heat-resistant, low-loss flexible substrate for robotics

Ideal for movable parts such as robotic arms. Achieves stable operation even in harsh environments.

In the robotics industry, devices with many movable parts, such as robotic arms and sensors, require high flexibility and durability. In particular, reliability that can withstand wiring in tight spaces and repetitive motions is crucial. Conventional circuit boards may face issues such as disconnection of movable parts or performance degradation in high-temperature environments. Our high heat-resistant, low-loss flexible circuit boards address these challenges. 【Application Scenarios】 - Movable parts of robotic arms - Sensor devices - Wiring in confined spaces 【Benefits of Implementation】 - High flexibility and durability - Stable operation in harsh environments - Space-saving design

  • スクリーンショット 2025-02-19 085503.jpg
  • Printed Circuit Board
  • Flexible PCB

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High heat-resistant, low-loss all-LCP flexible substrate for automotive applications.

High heat-resistant, low-loss all-LCP flexible substrate for automotive applications.

A flexible substrate that achieves high reliability even in harsh automotive environments.

In the automotive industry, the miniaturization and high performance of electronic devices are advancing, while high reliability is also required. Electronic components must operate stably even in harsh environments such as engine rooms and vehicle interiors, where temperature changes, vibrations, and oil exposure occur. Conventional flexible printed circuits have faced challenges regarding heat resistance and chemical resistance. Our all-LCP flexible printed circuits address these issues and contribute to improving the reliability of automotive electronic devices. 【Application Scenarios】 - Engine control units - In-vehicle displays - Various sensors - ADAS (Advanced Driver Assistance Systems) 【Benefits of Implementation】 - Stable operation in high-temperature environments - High durability against vibrations and shocks - Suppression of degradation from oil and chemicals - Assurance of long-term product lifespan

  • スクリーンショット 2025-02-19 085503.jpg
  • Printed Circuit Board
  • Flexible PCB

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High heat-resistant, low-loss flexible substrate for medical devices

High heat-resistant, low-loss flexible substrate for medical devices

Flexible substrates contributing to the miniaturization and high performance of precision medical devices.

In the medical device industry, there is a demand for miniaturization and high-density implementation of equipment to enable precise diagnosis and treatment. Particularly in medical devices that handle high-frequency signals, it is crucial to minimize signal loss and ensure stable operation. Conventional substrates may face challenges such as performance degradation and signal loss due to heat and humidity. Our high heat-resistant, low-loss flexible substrates address these issues and contribute to improving the reliability of medical devices. 【Application Scenarios】 - Medical devices such as endoscopes and catheters - Imaging diagnostic equipment such as MRI and CT scanners - Surgical robots 【Benefits of Implementation】 - Improved operability through miniaturization and lightweight design - Enhanced diagnostic accuracy through stable transmission of high-frequency signals - High reliability in harsh environments

  • スクリーンショット 2025-02-19 085503.jpg
  • Printed Circuit Board
  • Flexible PCB

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